April 9, 2023
The main aim of this project is to build a classification methodology to predict the quality of wafer ( faulty or good) sensors based on the given training data. Client will send the data in multiple set of files in batches at a given location. Data will contain Wafer names and 590 columns of different sensor values for each wafer. Apart from prediction files, we also require a “schema” file from client which contains all the relevant information about the training files such as: Name of the files, Length of Date value in FileName, Length of Time value in FileName, Number of Columns, Name of the Columns and their datatype.